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Nefab at ISTA 2016 TransPack Forum
We are delighted to share that we are once again a sponsor at the ISTA 2016 TransPack Forum in Orlando, Florida – March 21-24. Look for us in Booth 15.
We are delighted to share that we are once again a sponsor at the ISTA 2016 TransPack Forum in Orlando, Florida – March 21-24. Look for us in Booth 15.
Semiconductor manufacturing leaves no room for error. Every process, every component, every piece of equipment operates within microscopic tolerances, and that precision can’t be compromised once the machines leave the cleanroom. Yet, shipping high-value parts such as electrostatic chucks, pedestals, or showerheads introduces a whole new layer of risk.
Semiconductor manufacturing is a complex process that can be broadly divided into two main phases: the front-end process and the back-end process. Nefab partnered with a leading semiconductor manufacturer to optimize the packaging solution for shipping wafers between its front-end and back-end facilities, achieving significant financial and environmental benefits.
Why Shipping Grid Equipment Is a Different Kind of Challenge and How to Overcome It?