Packaging Solutions for Semiconductor Equipment
Custom packaging and logistics solutions designed for packaging and transporting of contamination-sensitive, high-value semiconductor equipment, precision sub-assemblies, and wafers.
Packaging for Capital Equipment
Heavy-duty, customized crates with advanced shock and vibration protection for front-end and back-end manufacturing machines.
Packaging for Components, Tools, and Wafers
Ultra-clean, secure inner packaging to prevent particle contamination and physical damage.
Packaging for Cleanrooms
Vacuum-sealed, particulate-free packaging manufactured in certified cleanroom products
Packaging Solutions Built for Semiconductor Logistics
Transporting semiconductor products is not just about moving goods from one location to another. It requires packaging solutions that support clean handling, reliable protection, and consistent performance across complex global supply chains.
Nefab develops custom packaging solutions for semiconductor applications using engineered materials and tailored designs to help protect sensitive products throughout transport, storage, and handling. Our approach focuses on balancing product protection, operational efficiency, and sustainability.
Global Packaging Engineering Expertise
With a global network of 250+ engineers and 6 ISTA-certified test labs worldwide, Nefab develops and validates packaging solutions for sensitive semiconductor applications across global supply chains.
Cleanroom-Compliant Packaging Solutions
We design, manufacture, and clean packaging solutions to support cleanroom requirements and ensure effective contamination control during transport and handling.
Measuring the Financial and Environmental Impact
Using our GreenCalc™ LCA tool, Nefab helps identify opportunities to reduce packaging cost and environmental impact through data-driven analysis.
Customer Cases: Tailored Packaging Solutions for the Semiconductor segment
Localization of Packaging Production for Semicon Contract Manufacturer
Nefab collaborated with a semiconductor manufacturer to optimize their wafer packaging solution, delivering substantial financial and environmental benefits.
Sustainable Packaging for Wafer Shipping
Nefab partnered with a leading semiconductor manufacturer to optimize the packaging solution for shipping wafers between its front-end and back-end facilities, achieving significant financial and environmental benefits.
Optimized Foam Inserts for RPS Adapters
Our customer was using a legacy packaging design for the RPS (Remote Plasma Source) Adapters that was inefficient and costly. By re-engineering the packaging, we developed a streamlined, resource-efficient solution that reduced material use and volumetric weight.
Multi-layered Packaging System for Hoisting Tool
A leading innovator in the semiconductor industry required a specialized packaging solution for hoisting tools used in their cleanrooms. Through a multi-layered, material-specific design they improved cleanliness, efficiency, and product security.
Plywood-based Solution for Test Head
A customer in the semicon sector faced high air freight costs, product safety concerns, and inefficient handling processes. By implementing the ExPak XL system, the customer achieved a 40% reduction in packaging weight, significantly lowering transportation costs and CO2 emissions.
Packaging Solutions for Capital Equipment, Components, Tools, Wafers & Cleanroom Products
Semiconductor packaging requirements vary by product sensitivity, cleanliness requirements, handling conditions, and logistics flow. Explore solutions for capital equipment, precision sub-assemblies, and recurring wafer or component logistics.
Capital Equipment and Precision Assembly Transport
For semiconductor manufacturing equipment, precision assemblies, and high-value tools that require engineered packaging for clean handling, shock and vibration mitigation, and controlled transport across complex supply chains and installation environments.
- Packaging for semiconductor manufacturing equipment
- Shock and vibration mitigation for sensitive systems
- Clean handling support for critical assemblies
- On-site packing and loading support
- Protection for domestic, intercontinental, and fab-related transport flows
Plywood Packaging Solutions
Our plywood based crating solutions are often combined with steel profiles, which creates a very rigid, strong but still lightweight solution. In addition, our plywood solutions are nail-free, which helps to create a safer, quieter work environment.
Wooden Packaging Solutions
Whether you're shipping semiconductor manufacturing equipment one-way or in returnable flow, we’ve got you covered with a wide range of innovative crating solutions.
Corrugated packaging solutions
Corrugated is the most widely used packaging material in the industry. This is due in large part to its low cost, light weight and ease of use.
On-Site Packing
Nefab offers on-site packing services tailored to customer requirements, supporting safe packing and loading at customer facilities, warehouses, or other designated locations.
Components, tools, and wafers
For recurring logistics flows supporting wafer movement, component handling, and returnable packaging systems across front-end, back-end, and inter-facility semiconductor operations.
- Reusable tray and returnable packaging systems
- ESD-safe protection for sensitive parts
- Packaging for recurring wafer and component flows
- Cleanroom-compliant packaging designs
- Efficient handling across internal and external logistics networks
Plastic Packaging for ESD-Sensitive Products
We offer several types of plastic solutions including clamshell wafer protection, ESD trays, and blisters to ensure that we can help you no matter the product that you are shipping.
Thermoformed Packaging Solutions
Packaging for wafers and sensitive components must help protect against handling damage while supporting operational efficiency. We offer custom thermoformed solutions as well as Reflex cushioning.
Reflex Cushioning
For electrostatic-sensitive and contamination-sensitive products, packaging design and material selection are critical. Nefab offers packaging options developed for clean handling environments and sensitive semiconductor applications.
Cleanroom packaging solutions
Our cleanroom packaging solutions are built to meet the needs of your industry, offering reliable protection and consistent quality. We tailor our services to match your specific requirements, helping to support your operations with care
Transport Totes
Transport Totes feature custom interior packaging for secure transport and storage. Tailored specifically for cleanrooms, they deliver reliable protection while minimizing contamination risks across your sensitive operations.
Cleanroom Transport Assemblies
Safely transport high-value semiconductor equipment with our customizable transport assemblies. We build these precise handling solutions to your exact needs while ensuring full compliance with ISO Class 5-7 cleanroom standards.
Cleanroom-to-Cleanroom Returnable Solutions
Streamline your cleanroom logistics with the innovative C2C Cube. Designed to maintain product integrity between cleanrooms, it also helps reduce waste through being a modular and returnable system. Equipped with integrated sensors, the C2C Cube provides real-time visibility, ensuring efficient and reliable operations.
Cleanroom services
We provide thorough cleaning services for the C2C cube, ensuring it meets top cleanliness standards. The cube can be cleaned, inspected, and prepared in our ISO class 5 and 7 cleanroom or at the customer's cleanroom if preferred.
Why Industry Leaders Partner with Nefab
In semiconductor supply chains, packaging is not a secondary concern. It directly affects product integrity, operational efficiency, and risk exposure across transport, handling, and cleanroom-adjacent environments. Nefab combines engineering, testing capabilities, and a global footprint to help customers turn packaging into a strategic advantage.
Logistics Services and Optimization Programs
Semiconductor logistics often require more than basic protection. Nefab supports customers with packaging solutions and services designed for contamination-sensitive handling, cleanroom requirements, and operational consistency.
Sustainability Expertise
Packaging performance is increasingly evaluated not only by protection, but by cost efficiency and environmental impact. Using GreenCalc™ Life Cycle Analysis, Nefab helps customers quantify improvement opportunities and support more informed packaging decisions.
Engineering knowledge
Semiconductor equipment, precision assemblies, and wafer-related flows demand packaging solutions designed around sensitivity, complexity, and performance under real-world logistics conditions. Nefab develops custom solutions tailored to product dimensions, fragility, cleanliness requirements, and transport risk.
Ewa Rosinek
Global Segment Director Semiconductors
Contact an expert
Join us in transforming the future of semiconductor packaging. Contact us today to find out how our bespoke solutions can add value to your logistic needs and contribute to a sustainable footprint within the industry.
Write your future in clean, sustainable, and efficient packaging -- With Nefab, you're covered on all fronts.
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