From the 21st to 23rd of January in Göttingen, Germany.
Our experts on packaging solutions for Lithium Batteries will participate in the specialist conference on Lithium Batteries in Göttingen, Germany.
During the conference breaks, they will be in the exhibition area, keen to discuss all packaging related topics. If you are at the conference, be sure to come by and have a chat.
Semiconductor manufacturing leaves no room for error. Every process, every component, every piece of equipment operates within microscopic tolerances, and that precision can’t be compromised once the machines leave the cleanroom. Yet, shipping high-value parts such as electrostatic chucks, pedestals, or showerheads introduces a whole new layer of risk.
Semiconductor manufacturing is a complex process that can be broadly divided into two main phases: the front-end process and the back-end process. Nefab partnered with a leading semiconductor manufacturer to optimize the packaging solution for shipping wafers between its front-end and back-end facilities, achieving significant financial and environmental benefits.
Why Shipping Grid Equipment Is a Different Kind of Challenge and How to Overcome It?