On the 19th and 20th of April, Nefab will take part in Automotive CEE Day.
On the 19th and 20th of April, Nefab will take part in Automotive CEE Day. As a major hub for B2B meetings in Central and Eastern Europe, the event serves as a crucial gathering place for automotive companies in the region. We are uniquely equipped to serve the industry, with a high level of expertise and a wide variety of solutions to save resources by optimizing supply chains.
Want to learn more? Register using the link below and come visit our team at booth 50, we are ready to meet you!
Semiconductor manufacturing leaves no room for error. Every process, every component, every piece of equipment operates within microscopic tolerances, and that precision can’t be compromised once the machines leave the cleanroom. Yet, shipping high-value parts such as electrostatic chucks, pedestals, or showerheads introduces a whole new layer of risk.
Semiconductor manufacturing is a complex process that can be broadly divided into two main phases: the front-end process and the back-end process. Nefab partnered with a leading semiconductor manufacturer to optimize the packaging solution for shipping wafers between its front-end and back-end facilities, achieving significant financial and environmental benefits.
Why Shipping Grid Equipment Is a Different Kind of Challenge and How to Overcome It?