• Customer Cases
  • Semiconductor

Nail-less, Lighter ExPak XL Solution

A customer in the semicon sector facing high air freight costs, product safety concerns, and inefficient handling processes needed a new packaging solution for their large and heavy products. By implementing the ExPak XL system, the customer achieved a 40% reduction in packaging weight, significantly lowering transportation costs and CO2 emissions. The new nail-less design, complete with an integrated ramp, improved product safety, simplified installation, and enhanced overall shipping efficiency without sacrificing protection.

Challenge: Cost, Safety & Shipping Efficiency

As demand for shipping products via air freight increased, the customer found their existing packaging solution was becoming expensive. The weight and bulk of their previous packaging solution drove up air freight expenses. They needed a more cost-effective alternative that did not compromise on protection or handling efficiency. In particular, they needed to ensure robust shock protection for large, heavy equipment during transit. They also wanted to improved the efficency of the packing and unpacking process.

Nefab’s Solution – ExPak XL Solution 

A comprehensive packaging solution was developed using the ExPak XL system to address the customer's specific needs for cost reduction, safety, and efficiency. The Nefab ExPak XL is a strong, plywood-based outer packaging solution. It’s an alternative to wooden crates that can be assembled faster and more safely, without the use of nail guns. For large heavy-duty applications: ExPak XL is ideal for companies that need to pack large products weighing several tons. 

  • Nail-less Design with Integrated Ramp: The innovative nail-less design allows for quick and easy assembly and disassembly without requiring any tools. This simplifies the logistical process for the end customer during unpacking. A ramp was also incorporated into the design, making it easier to load and unload the heavy equipment and maneuver it through narrow spaces.
  • Lightweight Materials: The new design achieved a 40% weight reduction compared to the previous solution. This significantly lowered overall shipping costs for air freight while maintaining the durability and protection standards required. The lighter packaging also created a safer handling environment for personnel during loading and unloading.
  • Enhanced Shock Protection: Through advanced engineering, the solution was optimized to provide improved shock protection while using fewer materials. Extraneous elements like foam and excess wooden fitments were eliminated, successfully enhancing product safety and minimizing environmental impact.

Results: Increased Cost Savings, Safety, and Efficiency 

The implementation of the new ExPak XL packaging solution delivered significant, measurable improvements for the customer.

  • Lower CO2 emissions: The reduction of packaging weight was achieved, lead to a decrease of 42% of annual CO2 emissions
  • Enhanced Product Safety: Product safety was maintained and even enhanced, despite using fewer packaging materials, which also reduced the solution's environmental impact.
  • Improved installation and unpackaging processes: The tool-free, nail-less design enabled swift and effortless installation and unpacking, minimizing labor costs and time.

Ready to Take the Next Step?

Switching to our a nail-less & lightweight ExPak XL solution reduced packaging weight by 40%, lowering the environmental impact and reducing excessive packaging materials, weight, and labor cost.

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See our comprehensive packaging and logistics services designed specifically for the semicon sector.

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See our comprehensive packaging and logistics services designed specifically for the semicon sector.

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