Only one week until The Battery Show Europe!
Come see us at Booth 10-D34, we will be showing returnable and expendable packaging for cells, modules and packs.
Our IoT team will also be present with the latest technology to support connected packaging and effective pooling management.
👉 There is still time to register to attend the show, free of charge, by either using the link in the banner or clicking here: https://l.feathr.co/BatteryShowEurope/Nefab-AB
Semiconductor manufacturing leaves no room for error. Every process, every component, every piece of equipment operates within microscopic tolerances, and that precision can’t be compromised once the machines leave the cleanroom. Yet, shipping high-value parts such as electrostatic chucks, pedestals, or showerheads introduces a whole new layer of risk.
Semiconductor manufacturing is a complex process that can be broadly divided into two main phases: the front-end process and the back-end process. Nefab partnered with a leading semiconductor manufacturer to optimize the packaging solution for shipping wafers between its front-end and back-end facilities, achieving significant financial and environmental benefits.
Why Shipping Grid Equipment Is a Different Kind of Challenge and How to Overcome It?