我們很高興地宣佈，自 2024 年 3 月 1 日起，Patric Vestlund 被任命為Nefab集團美洲區新任執行副總裁。
Patric 在特瑞堡、ITW 和 Enertech AB 等多家知名公司擔任行政領導已有近 25 年的經驗。多年來，他成功地管理了北美等地區的企業和組織，尤其是他過去 10 年居住的美國、歐洲和南部非洲等。Patric目前是特瑞堡塗層系統公司北美區總裁，現居美國北卡羅來納州夏洛特市。
Semiconductor manufacturing leaves no room for error. Every process, every component, every piece of equipment operates within microscopic tolerances, and that precision can’t be compromised once the machines leave the cleanroom. Yet, shipping high-value parts such as electrostatic chucks, pedestals, or showerheads introduces a whole new layer of risk.
Semiconductor manufacturing is a complex process that can be broadly divided into two main phases: the front-end process and the back-end process. Nefab partnered with a leading semiconductor manufacturer to optimize the packaging solution for shipping wafers between its front-end and back-end facilities, achieving significant financial and environmental benefits.
Why Shipping Grid Equipment Is a Different Kind of Challenge and How to Overcome It?