The Challenge: Protecting Motherboards during Shipping
The company faced significant challenges with its existing packaging solution for a large, delicate motherboard used in high-end technology products. The previous approach involved a combination of corrugated boxes reinforced with EPE and EVA foam. However, key issues included:
- Recyclability Limitations: Certain materials were glued together, making proper recycling nearly impossible.
- Transport Damage: The previous packaging design did not adequately safeguard the product, leading to costly damage during transit.
- Environmental Impact: The non-optimized design increased material waste and carbon footprint.
The organization needed a streamlined solution that could enhance product protection, improve recyclability, and reduce costs.
Nefab's Solution: Hybrid Packaging Innovation with HDPE Thermoformed Reflex Components
The packaging solutions provider delivered a groundbreaking hybrid design that significantly outperformed its predecessor. Key elements of the solution included:
- HDPE Thermoformed Reflex Components: The design featured a clamshell structure to hold the motherboard securely, supplemented by Reflex cushioning components for comprehensive protection. These elements were crafted from 100% recycled HDPE that is fully recyclable.
- Optimized Corrugated Box: A better-structured outer box offered enhanced strength and reduced material usage.
- Anti-Static LDPE Bag: To further safeguard the sensitive electronics, a protective anti-static bag was incorporated into the design.
This innovative solution not only reduced environmental impact but also enhanced the product’s safety during transit.
